Thermo-Mechanical Reliability and Electrical Performance of Indium Interconnects and Under Bump Metallization

This thesis presents reliability analysis of indium interconnects and Under Bump Metallization (UBM) in flip chip devices. Flip chip assemblies with the use of bump interconnections are frequently used, especially in high density, three-dimensional electronic devices. Currently there are many methods for interconnect bumping, all of which require UBM. The UBM is required for interconnection, diffusion resistance and quality electrical contact between substrate and device. Bonded silicon test vehicles were comprised of Indium bumps and three UBM compositions: Ti/Ni/Au (200\xc5/1000\xc5/500\xc5), Ti/Ni (200\xc5/1000\xc5), Ni (1000\xc5). UBM and indium were deposited by evaporation and exposed to unbiased accelerated temperature cycling(-55°C to 125°C, 15°C/min ramp rate). Finite Element Analysis (FEA) simulations were used to gain understanding of non-linear strain behavior of indium interconnects during temperature cycling. Experimental testing coupled with FEA simulations facilitated cycle-to-failure calculations. FEA results show plastic strain concentrations within indium bump below failure limits. It has been demonstrated that fabrication of Ti/Ni/Au, Ti/Ni, and Ni UBM stacks performed reliably within infant mortality failure region

Finishing the euchromatic sequence of the human genome

The sequence of the human genome encodes the genetic instructions for human physiology, as well as rich information about human evolution. In 2001, the International Human Genome Sequencing Consortium reported a draft sequence of the euchromatic portion of the human genome. Since then, the international collaboration has worked to convert this draft into a genome sequence with high accuracy and nearly complete coverage. Here, we report the result of this finishing process. The current genome sequence (Build 35) contains 2.85 billion nucleotides interrupted by only 341 gaps. It covers ∼99% of the euchromatic genome and is accurate to an error rate of ∼1 event per 100,000 bases. Many of the remaining euchromatic gaps are associated with segmental duplications and will require focused work with new methods. The near-complete sequence, the first for a vertebrate, greatly improves the precision of biological analyses of the human genome including studies of gene number, birth and death. Notably, the human enome seems to encode only 20,000-25,000 protein-coding genes. The genome sequence reported here should serve as a firm foundation for biomedical research in the decades ahead